Thermal Interface Materials TIC800A

The thermal Interface MaterialsTIC™800A Series islow melting point thermal interface material. At 50°C, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. The TIC™800A Series shows no thermal performance degradation after 1,000 hours@130°C,or after 500 cycles, from -25°C to 125°C.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.Features 1.0.020°C-in² /W thermal resistance 2.Naturally tacky at room temperature, noadhesive required 2.No heat sink preheating requiredApplications 1.High Frequency Microprocessors 2.Notebook and Desktop PCs 3.Computer Serves 4.Memory Modules 5.Cache Chips 6.IGBTs 6.IGBTs 7.LED Server power