thermal conductive pad

Thermal conductive pad main features: thermal conductivity, insulation,Super Soft,filled,viscidity. thermal gapfillerpad Uses: used in electrical and electronic products, control board, TFT-LCD, notebook computers, power supply,High efficiency led lamp and other products, from thermal conductivity, filling, damping effect; can be added one-sided silicone cloth to enhance its mechanical properties, can be directly glued to the surface of the body parts without the need for reinforcement with the bolt and so on. (According to the different needs of customers into any shape of die-cut sheets can also be affixed adhesive or gluing).Typical applications: Customers can heat body and heat sink the size of the gap between the selection of a suitable thickness of the thermal silica films, used in electronic products, electronic equipment, heating power devices (integrated circuits, power management, SCR, transformers, etc.) and the cooling facilities (heat sink, aluminum, etc.) in close contact, to achieve better thermal conductivity results. thermal conductive materials --thermal conductive pad Test Projecttest results flat thermal silica filmsUnitstesting standardsTPBTPWcolor AllAll---Visualthickness 0.5-120.5-12mmASTM D374The proportion 1.8±0.32.0±0.3---ASTM D792Hardness 12-4512-45Shore CASTM D2240Temperature range -40 +220-40 +220EN 344Breakdown voltage >6>6Kv/mmASTM D149Volume Impedance >1.2×10111.0×1011Ω.cmASTM D257Blocking probability V-0V-0--UL-94Thermal Conductivity 3.01.0W/mkASTM D5470