SP360C BGA rework station

SP360C BGA rework station Specification: Applicable PCB sizeMax PCB size: 430mmX350mmApplicable BGA sizeMax size: 55mmX55mmMin size: 7mmX7mmMax weight: 80gPower for operation: 3600WMain heater: 800WLower heater: 800WBottom heater: 2000WMachine dimension: 650*500*600mmMachine weight: 36KGInput power: AC 220V 3.6KW Description1. High quality heating material produces high-tem breeze, precisely controlling the solderingand desoldering process.2.Movable heating head, able to move horizontally; easy to operate;4. mbedded industrial computer, touch screen interface, PLC control; real-time temperaturecurve display, able to display set curve and practically-tested curve; 7.2’ high definitionscreen, convenient for operation and observation;5.Industrial computer able to store unlimited temperature curves, curve analysis can be done ontouch screen; both English and Chinese can be input;6 The temperatures of the upper and lower heater can be precisely controlled according to settemperatures; bottom constant temperature infrared heating area; appropriate temperaturecontrol apparatus can ensure safe rework for BGA;7. The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;8. Powerful cross flow can cool the lower heating area;9. The adjustable PCB positioning supports, easy and fast to install PCB; special fixture forinstalling allotype boards ;10. with sound alarming function after finishing soldering or desoldering; hand vacuum pen easyfor picking up BGA;11. Set with over temperature alarming and protection function;12. Equipped with different hot gas nozzles, easy to replace; can be customized according tospecific needs;13The integrated design of machine and chassis is room-saving.