Silicon carbide powder

for wire sawingHigh purity:min. SIC% 99%.Excellent performance in total cost saving and cutting efficiency.No recycled mixture.Top raw materialGreen,crystal structure,high hardness and strong cutting ability,stable chemical characteristics,good thermal conductivity.Microcosmic shape is a hexagonal crystal Mohs hardness is 9.2.Vickers hardness is 3000-3300 kg/mm.microhardness is 3000-3300kg/mm3.Among abraisives,the hardness of silicon carbide is higher than corudum and ranked below diamond,CBN and boron carbide.Density viewed is generally 3.2g/mm3,density of heap is 1.2-1.6g/mm3,.Raw materials are petroleum coke and quality silicon sand, and then appended with salt and smelted in eletric arc furnace.Main applications:solar and semiconductor wafer wire sawing,crystal and ferrite polishing,ceramis and special steel precision polishing,bonded and coated abraisives tools,cutting and polishing,non ferrous meatal lapping such as glass,stone,agate and high grade jewelry,high grade refractory materials,engineering ceramic,heating elements and thermal elements.Our products are of high purity,high hardness,narrow distribution,good grain shape,no coarse grains..It is mainly used for wire-sawing monocrystalline silicon and polycrystalline silicon,gallium arsenide,quartz crystal.Our silicon carbide micro powder is of high performance in improving the cutting efficiency, production cost reduction and wafer quality control.Particle size comparison of commonly used abrasiveParticle size distribution (micron)Chemical IndexPhysical IndexSizeD3D50D94SiC ≥%Fe2O3 ≤(%)FC ≤(%)PHValueDensity of heapMagnetic Materials≤(%)GCJIS800#≤20.014.0±1.0≥9.099.000.200.26--81.180.008GCJIS1000#≤18.311.5±1.0≥7.098.500.200.26--81.150.008GCJIS1200#≤17.09.5±0.8≥5.598.500.200.26--81.130.005GCJIS1500#≤14.58.0±0.6≥4.598.000.200.26--81.120.005GCJIS2000#≤13.06.7±0.6≥4.098.000.200.26--81.000.005GCJIS2500#≤12.05.5±0.5≥3.598.000.200.26--80.950.005