SB-300 smd adhesive - Surface Mount Adhesive

PRODUCT DESCRIPTION SB-300Surface Mount Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance (uncured) Red viscous gel Components One component - requires no mixing Cure Heat Cure Application Surface Mount Adhesive Key Substrates Electronic components to printed circuit boards. Other Application Areas Small Parts Bonding Dispense Method Stencil print Wet Strength High Dot Profile Peaked SB-300 is designed for the bonding of surface mount devices to printed circuit boards prior to wave soldering. Particulary suited where very high speed dispensing, high dot profile, high wet strength and high electrical specifications are required. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25°C 1.25 Yield value @ 25°C, Pa: Cone & Plate Rheometer, M10 with PK1, 2° Cone: Casson Model over 0.4- 30 sec-1 250 to 700 TYPICAL CURING PERFORMANCE Recommended conditions for curing are exposure to heat above 100°C (typically 120 150 secs @ 150°C). Rate of cure and final strength will depend on the residence time at the cure temperature. TYPICAL PROPERTIES OF CURED MATERIAL Cured for 30 minutes @ 150°C. Physical Properties: Coefficient of Thermal Expansion, ASTM D 696, K-1 145×10-6 Coefficient of Thermal Conductivity, ASTM C177, W.m-1 K-1 0.40 Specific Heat, kJ.kg-1 K-1 0.30 Density, BS 5350, g/cm³ 1.40 Glass Transition Temperature, (Tg), ASTM E 228, °C 110 Electrical Properties: Dielectric Constant / Loss, ASTM D 150: 1kHz 3.70 / 0.02 10 kHz 3.30 / 0.02 1 MHz 3.20 / 0.03 10 MHz 3.10 / 0.03 Volume Resistivity, ASTM D 257, .cm 4×1015 Surface Resistivity, ASTM D 257,4×1015 Direction for use 1. After storage in a refrigerator the adhesive must be allowed to equilibrate to room temperature before use, typically 12 hours. 2. Avoid cross contamination with other epoxy or acrylic adhesives by ensuring dispense nozzels, adapters etc. are thoroughly cleaned. 3. The quantity of adhesive dispensed will depend on the dispense pressure, time, nozzle size and temperature. 4. These parameters will vary depending on the type of dispensing system use and should be optimised accordingly. 5. Bath temperature should ideally be controlled at a value between 25°C-30°C, 50%RH for optimum results. Under these conditions product will remain dispensable in the tray for at least 2 to 3 days. 6. Uncured adhesive can be cleaned from the board with isopropanol, MEK or glycol ether blends such as Prozon. Storage Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Products shall be maintained, optimally, at temperatures between 2°C to 8°C unless otherwise labeled, or, specified. Storage, at temperatures below 2°C, or, greater than 8°C, is not recommended. Temperatures below 2°C and above 8°C can adversely affect product properties. Note The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide.