Quad flat package(QFP)

Application This is a surface-installation type package used for the ASIC for industrial and communications equipment.Material The main body consists of co-firing multilayer alumina ceramics, and lead terminals made of an alloy of iron and nickel are attached with silver-brazing to the main body.Features Because the lead pitch is ultra-fine (0.5 mm or less), it can meet the demand for a compact and slim package with high packaging density of 200 pins or more.