polyamide hotmelt adhesive

Polyamide Hotmelt Adhesive [Product Definition] Dimer acid polyamide hotmelt adhesive by dimer acid and the multi-dimensional amine becomes after the high temperature condensation reaction, has the viscosity lowly, the flow properties good, toughness good, the cementation intensity higher characteristic. [Use] The product mainly uses in material and so on fabric, leather, lumber, plastic, metal, ceramics agglutinations, as well as uses in the electronic primary device the cementation, the books binds and so on. [Performance Index] softening point 100 140 °C acid value ≤8 mgKOH/g amine value ≤6 mgKOH/g viscosity 2000 6000 mPa·S/190°C shearing strength ≥4 MPa, AL/AL peeling intensity ≥100 N/25mm, PE/PE,60±2°C low temperature toughness Does not break 5°C [Packing and Storage and Transport] 25kg plastic weave bag, moisture-proofstorage and transport.