FR4 Copper Clad Laminate

FR4 Copper Clad Laminate

Changzhou, China
Production capacity:
100000 Piece / Month
Changzhou, China
Company
0086-0519-83253355
James Zhang
Contact person

Basic Information

Type Insulation Sheet
Material Fiberglass
Application High Temperature
Place of Origin Jiangsu China (Mainland)
Brand Name ZY
FR4 Copper Clad Laminate: High Reliable Multi-functional epoxy Laminate FEATURES Suitable for undemanding lead-free process CHARACTERISTICS:Tg135+/-5°C(DSC) Lower water absorption Compatible with AOI equipment Excellent UV-blocking performance Good dimensional stability Flammability UL94V-0 Meet the specification of IPC- 4101/21PRODUCT SIZE & THICKNESS:THICKNESS INCH(mm)COPPER CLADDING OZ (um)SIZE INCHmmTHICKNESS TOLERANCE0.004(0.1) to 0.125(3.2)0.5 (17) 1.0 (35) 2.0 (70)37×49 940×1245 41×49 1041×1245 43×491092×1245 CLASSC/M TYPICAL PROPERTIES :ThermalPropertiesTest conditionTypical ValueUnitSPECTest MethodGlass Transition Temp.DSC150+/-5°CN/A2.4.25Z-axis CTE under TgTMA45 60ppmN/A2.4.24Z-axis CTE above TgTMA290 320ppmN/A2.4.24Z-axis PTE 50-260°CTMA3.0%N/A2.4.24ElectricalDielectric constant (1MHz)C/24/23/504.2-4.81MHz5.4↓2.5.5.9Dissipation factorC/24/23/500.010-0.0201MHz0.035↓2.5.5.9Arc resistanceD/48/50+D/0.5/2390↑Sec60↑2.5.1Dielectric breakdownD/48/5060↑KV40↑2.5.6Comparative tracking indexD/36/38/85220V175-250IEC60112Volume resistivityC/96/35/905 7*10 7MΩ-cm10 6↑2.5.17Surface resistivityC/96/35/903 5*10 7MΩ10 4↑2.5.17PhysicalPeel strengthCond.A>8Ib/in0.5OZ 6 ↑2.4.8>101.0OZ 8 ↑2.4.8Flexural strengthCond.A480-550MPaL/W 415↑2.4.4415-450C/W 345↑Dimensional stabilityE 4/1050.01-0.04%0.05↓2.4.39FlammabilityC/24/23/50+E/24/125UL94V-0--94V0UL94Water absorptionD/24/230.1-0.3%0.35 ↓2.6.2.1Solder float288°C>120Sec102.4.13.1Thermal stress288°C/10sec/cooling10-15Times32.4.13.1T260TMA15MinN/A2.4.24.1T288TMA2MinN/ATd10 °C/Min,5% Wt Loss310°CN/ATBD 5%wt loss

Delivery terms and packaging

Packaging Detail: It depends on customer's needs Delivery Detail: Within 15 days after payment
Port: Shanghai

Payment term

Letter of credit

Telegraphic transfer

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