electronic component

Our trained QC engineers use a state of the art, multi-step inspection detection processes to identify counterfeit and cloned products. The process begins with analyzing the shipping and packaging. It continues with the parts undergoing several levels of inspection including: marking and dimension checks, internal visual analysis, material analysis and electrical testing to insure the safety of the production.Inspection of external and internal packing Inspection of part number, date code, package, quantity Label comparison with picture database IC marking comparison with picture database Measuring of the physical dimensions of the component Inspection of the condition of the pins or balls for the component Inspection of the inside bond arrangement of the die via X-Ray Ship the parts to test lab to perforum the Level 2(Visual inspection test decapsulation) and Level 3(Electronic Functional test) based on our customer reqirement.