CPU-Thermally Conductive Gap

The thermal conductive of TIF™300 Series are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. Features: 1.Good thermal conductive:2.8 W/mK 2.Naturally tacky needing no further adhesive coating 3.Soft and Compressible for low stress applications 4.Available in varies thickness Applications: 1.Cooling components to the chassis of frame 2.High speed mass storage drives 3.RDRAM memory modules 4.Micro heat pipe thermal solutions 5.Automotive engine control units 6.Telecommunication hardware 7.Handheld portable electronics 8.Semiconductor automated test equipment (ATE) Typical Properties of TIFTM300ColorGrayVisualConstruction & CompostionCeramic filled silicone elastomer***Specific Gravity2.5 g/ccASTM D297Heat Capacity1 l/g-KASTM C351Hardness35 Shore 00ASTM 2240Tensile Strength35 psiASTM D412Continuous Use Temp-50 to 200°C***Dielectric Breakdown Voltage>1500 VACASTM D149Dielectric Constant10.2 MHzASTM D150Volume Resistivity7.3X1011 Ohm-meterASTM D257Flame Rating94 V0equivalent ULThermal Conductivity2.8 W/m-KASTM D5470 OF