Centerless Grinding

The resin bonddiamond wheelshave the features of good self-sharpening,sharp cutting,high efficiency,low roughness of work piece surface,few heat generating and without burning workpiece,they are suitable for high efficiency and precision grinding of most workpieces. Our institute is able to provide resin bond superabrasive grinding wheels according to the standard GB/T6409.2-1996.The diameter range is φ10-700mm;the thickness range is 0.07-300mm;the grit size range is 60/70W3.5. We can also design and make nonstandard grinding wheels according to customers requirement Application: Resin bond diamond products;mainly used for machining tungsten carbide,ceramic materials magnetic materials,silicon materials.silicon materials ,thermal spraying alloy materials and so on. Resin bond CBN products:mainly used for machining high speed steel,cast iron and so on.