Cellphone boards (multilayer PCB)

Cellphone boards (multilayer PCB): 1) layer:4-20 2) material:FR4,LDP(LDD),RCC 3) Min. Mechanical Drilled Hole Size : 8mil (0.200mm) 4) Min. Laser Drilled Hole Size : 4mil (0.100mm) 5)Line Width/Spacing : 3mil (0.075mm) 6)Maximum Production panel size : 21.5” x 24.5” (546mm x 622mm) 7) Line width/spacing : +/-10% 8)PTH Diameter: +/-0.002 inch (0.050mm) 9)Non-PTH Diameter: +/-0.002 inch (0.050mm) 10) Hole Location : +/-0.002 inch (0.050mm) 11) Hole to Edge Dimension : +/-0.004 inch (0.100mm) 12)Edge to Edge Dimension : +/-0.004 inch (0.100mm) 13) Layer to Layer Registration: +/-0.003 inch (0.075mm) 14)Controlled Impedance : +/- 8% 15)Allowable Warpage : Max. 0.5%