Butterfly Package

Butterfly Package General information: 1.Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and marking on the surface. 2.Material:4J29(FeNiCo) alloy/WCu alloy. 3.Surface plating:Ni/Au plating,selective Au plating. 4.Technical requirement: All of the property index conform to the requirements of GJB2440A<<Gen- eral Standard of Hybrid Integrated Circuit Package>>. 5.High Frequency Design,ideal for speed devices. 6.Enhanced thermal conductivity,ideal for TEC installation. Typical requirement: 1.Au plating thickness ≥0.7µm;Ni plating thickness is between 1.3-11.43µm. (We can also according to the requirements of customer) 2.No blisters on Au after 3 minutes at 350 deg-celcius(in air)as seen under 10x magnification. 3.Isolation resistance>10 MEG OHMS at 100V DC. 4.RoHS compliant. 5.No cracks,peeling,flaking,blister,burrs,stains,spots,contamination.