Add molding electronic adhesive LSR - 3118T

Properties and USES 1, this article mainly used in electronic industry, the product can room temperature or medium temperature vulcanization, vulcanization former sizing material low viscosity, facilitate infusion, vulcanization not exothermic, no low molecular out, little shrinkage, no corrosion, vulcanizates available in - 60 250 °C long-term use under, has moisture-proof, water resistant, weather resistance, ageing resistance radiation characteristics, heating can fast-curing, suitable for mass potting, electric performance is superior. 2, used in electronic components potting, adhesive, coating materials, up moistureproof, water resistant, insulation, shockproof, flame retardant, resistant to radiation resistance and climate ageing functions. The main technique parameters TypeLSR-30XX LSR-3118TClass typeuniversal Gel type universal universal Appearance AColorless transparent graytransparent Appearance B transparent A and B component proportion 1than11than19than1 1than1 Viscosity A (pa · s) 1.51.55.0 5.50.8 1.0 Viscosity B (pa · s) 0.50.6-0.8 Hardness (JIS A) 2070(needle into degrees)5030 35Resistance to tear strength (KN/m) //7/ Tensile strength (Mpa) //4/ Elongation (%) //150150 Line shrinkage rate (%) 0.10.10.10.1Can operation time (25 °C / h) 1.5 21.5 21.5 21.5 2Curing conditions (°C / h) 25/24h100/0.5h80 120/1 4100/1hDensity (25 °C)0.980.981.251.3