1 + 1 + N + 1 + 1 HDI PCB mit Gold Steckverbinder 8 layer HDI board, total thickness 1.0mm, 0.1mm blind vias L1-2, L7-8, buried vias L2-3, L6-7, L3-6, L2-7, impedance control, OSP+hard gold edge conn
Halogen FR4 PCB 2 layer PCB, halogen free FR4 material, 1.6mm board thickness, 35um copper both layers, immersion gold finish, UL, ROSH compliant shipping terms: FOB
6-Schicht-Starr-Flex-Leiterplatte mit Impedanzkontrolle 6-layer rigid-flex PCB 2-layer flex + 4 layer rigid Adhesiveless material Impedance control Immersion gold UL and RoHS compliant Shipping terms: FOB,
Rogers PCB 2 layer PCB, Rogers 4003 material,1.6mm board thickness, 1ozcopper both layers, OSP finish, green solder maskUL, ROSH compliant shipping terms: FOB,
2-Schicht Aluminium PCB mit Bleifrei HAL-Finish 2-layer aluminum based PCB Lead-free HAL finish UL and RoHS compliant Shipping terms: FOB, DDU Payment terms: T/T, L/
8 Schicht Rigid-Flex-Leiterplatte, gebildet von Panasonic R-F775 8 layers rigid-flex PCB 2 flexible layers Panasonic R-F775 material UL, RoHS compliant Shipping terms: FOB, DDU Payment terms: T/T, L/
14L Platine mit Gold Finger 14L PCB board, FR4, 1.6mm, 35um finished copper thickness, min space/trace: 4/4.6mil, min hole: 0.2mm, Au thickness for Immersion Gold are 2-3u"
10L Platine 10Lpower systemboard, FR4, 1.57mm, 1oz,Immersion Goldfinish (Au: 2u"), min trace/space: 0.125/0.125mm, min hole: 0.3m
8L Platine 8L notebook PC board, FR4, 1.4mm, 1oz, OSP finish, min trace/space: 0.125mm, min hold: 0.2mm, BG
8L HDI Leiterplatte 8L HDI PCB board, FR4, 1.2mm, 35um finished copper thickness, min space/trace: 3.5/4.7mil, min hole: 0.15mm, Au thickness for Immersion Gold are 2-3u
6L Platine 6L computer board: VGA card, FR4, 1.57mm, 35um copper thickness, Immersion Gold and plate gold finish, min trace/space: 0.08/0.1mm, min hole size 0.2
6L Platine 6L communication equipment board, FR4, 1.57mm, 1oz, OSP finish, min trace/space: 0.09mm, min hold: 0.3m
4L PWB-Brett mit Gold Finger 4L pcb board with gold fingers, Au thickness for gold fingers are 30u", red solder mas
2L Leiterplatte 2L PCB board, FR4, 0.6mm, LCD board, min space/trace: 0.125mm, min hole: 0.3mm, Au thickness for Immersion Gold: 2-3u"
Aluminium Leiterplatte 1. 2L Aluminium board withblack solder mas
Aluminium Leiterplatte 1. 1L Aluminium board withblack solder mas
Starrflex-Leiterplatten- Model:Rigid-flex board-3L01Layers:3Material:FR4+PISurface treatment:Immersion GoldWidth/space:4/4milFinish thickness:0.05mm(flex),1.2mMin Hot:0.3m
Starrflex-Leiterplatten- Model:Rigid-flex board-6L01Layers:6Material:FR4+PISurface treatment:Immersion TinWidth/space:4/4milFinish thickness:0.2mm(flex),1.6mMin Hot:0.7m
Starrflex-Leiterplatten- Model:Rigid-flex board-10L01Layers:10Material:FR4+PISurface treatment:Immersion GoldWidth/space:3/3.5milFinish thickness:0.2mm(flex),1.2mMin Hot:0.3m
Starrflex-Leiterplatten- Model:Rigid-flex board-6L01Layers:6Material:FR4+PISurface treatment:Immersion GoldWidth/space:4/4milFinish thickness:0.2mm(flex),0.8mMin Hot:0.3m
Starrflex-Leiterplatten- Model:Rigid-flex board-10L01Layers:10Material:FR4+PISurface treatment:Immersion GoldWidth/space:4/4milFinish thickness:0.2mm(flex),1.6mMin Hot:0.1m
Starrflex-Leiterplatten- Model:Rigid-flex board-4L01Layers:4Material:FR4+PISurface treatment:Immersion GoldWidth/space:4/4milFinish thickness:0.2mm(flex),1.6mmMin Hot:0.3m
Multilayer- Model:Multilayer PCB-8L01Layers:8Material:FR4 Tg170Surface treatment:Immersion GoldWidth/space:3/3milFinish thickness:1.6mmMin Hot:0.2m
Multilayer- Model:Multilayer PCB-16L01Layers:16Material:FR4 Tg170Surface treatment:Immersion GoldWidth/space:4/4milFinish thickness:2.4mmMin Hot:0.3m
Multilayer- Model:Multilayer PCB-12L01Layers:12Material:FR4 Surface treatment:Immersion GoldWidth/space:3/3.5milFinish thickness:1.6mmMin Hot:0.2m
Multilayer- Model:Multilayer PCB-16L01Layers:16Material:FR4 Surface treatment:Immersion GoldWidth/space:3/3milFinish thickness:2.0mmMin Hot:0.3m
Starre Leiterplatten Rigid pcb specificationPCB / Ciruit / flex-rigid/flexible/quick turn/prototypingLayer Count 1-30 layer Material Shengyi/KB/ITEQ/Arlon / Rogers/Alumiu
bga / BGA PWB bga/bga pcb specificationPCB / Ciruit / flex-rigid/flexible/quick turn/prototypingLayer Count 1-30 layer Material Shengyi/KB/ITEQ/Arlon / Rogers/Alum
4 Schicht Rigid-Flex Leiterplatten 4 Layer Rigid-flex pcb 1.Layer:4 2.Material:FR4 3.Board finished thickness:0.9mm 4.Min.Lin width:5mil 5.Min.line spacing:5mil 6.Surface finish/treatm
Gold finger PCB Gold finger pcb Multilayer pcb: 1)6-layer &12 layer 2)Material:FR4 3)Board thickness:1.6mm 4)Surface finish/treatment:ENIG 5)Min.line width:4mil
Multilayer Hartgold 8 layer 1 Layer:8 2 Material:FR-4 TG170 3 Board finished thickness:1.57mm 4 Min.Lin width:6mil 5 Min.line spacing:6mil 6 Surface finish/treatment:Imm
Schaltung circuit specificationPCB / Ciruit / flex-rigid/flexible/quick turn/prototypingLayer Count 1-30 layer Material Shengyi/KB/ITEQ/Arlon / Rogers/Alumium/
Leiterplatte PCB specificationMaterial FR4 Finish Thickness 62mil Min Width/Spacing 6mil/6mil Min finish Vias dia 0.3mm Copper thickness 35um Surface Finish Immer
Leiterplatten mit Rogers Rohstoff Printed circuit boards PCB specificationMaterial FR4 Finish Thickness 62mil Min Width/Spacing 6mil/6mil Min finish Vias dia 0.3mm Copper thickness 35
PCB Fertigung pcb fabrication specificationPCB / Ciruit / flex-rigid/flexible/quick turn/prototypingLayer Count 1-30 layer Material Shengyi/KB/ITEQ/Arlon / Rogers/
Leiterplattenbestückung pcb assembly specificationPCB / Ciruit / flex-rigid/flexible/quick turn/prototypingLayer Count 1-30 layer Material Shengyi/KB/ITEQ/Arlon / Rogers/Alu
HPS150 Serie Leistungswiderstände EBG's series HPS(Power resistors) is rated at 150 Watts mounted to a heat sink. The increased height of the package makes this resistor ideal in appl
HPP150 Serie Leistungswiderstände EBG's series HPP(Power resistors) is rated at 150Watts mounted to a heat sink. There are four configurations of resistive patterns available in the p
EE / RE / NE-Serie Präzisions-Metall-Film fixiert resisto EE/RE/NE Series precision metal film fixed resistors Dimensions(mm) Type EE/1/20EE1/10NE1/10EE1/8NE1/8EE1/4NE1/4EE1/2NE1/2L±0.34.306.8010.215.
MXP35 Reihe Leistungswiderstand MXP35 series power resistors The special performance features of the Type MXP include: 35 Watt power rating at 25°C TO-220 package configuration
UXP800 Serie Leistungswiderstände UXP800 series power resistors For variable speed drivers, power supplies, control devices, robotics, motor control and other power designs, the easy
UXP600 Serie Leistungswiderstände UXP600 series Power resistors For variable speed drivers, power supplies, control devices, robotics, motor control and other power designs, the easy
LXP100 Serie Leistungswiderstände LXP100 series power resistors EBG offers the totally encapsulated and insulated TO-247 package for low ohmic value and non-inductive design for high
HXP200 Serie Leistungswiderstände HXP200 series Power resistors Due to a non inductive design these elements are ideally suited for high frequency and pulse load applications. By dire
UXP300 Serie Leistungswiderstände UXP300 series Power resistors Mainly used as a snubber resistor to compensate the C-R peaks in traction power supplies. General Characteristics Elect
AR-Serie SMD High Precision Metallfilmwiderstände AR Series SMD High Precision Metal Film resistors Dimensions(mm) TypeLWTD1D2AR02(0402)1.00±0.050.50±0.050.30±0.050.20±0.1
Potentiometer Long life, high stability, widely used in printing machinery and packaging machinery, et
Potentiometer Long life, high stability, widely used in printing machinery and packaging machinery, et
Potentiometer Long life, high stability, widely used in printing machinery and packaging machinery, et
Potentiometer Long life, high stability, widely used in printing machinery and packaging machinery, et
