Aluminum PCB für LED- 1,Our Product range We offer a wide range of PCBs such as single-sided, double-sided, multi-layer, high frequency, MCPCB, metal-backed PCB and so on.
Round Aluminium Based MCPCB Round Aluminum MCPCB used for LED Lighting Aluminium PCB Manufacture Capability Technology Project Manufacture Capability Product Type Aluminium /Cop
doppelseitigen Leiterplatte mit abschließenden 5 OZ Kupfer und 2 OZ ho final copper: 5OZ final copper on hole wall: 2 OZ surface treatment: imm. gol
4 Lagen Leiterplatte mit mehreren Modellen in einem Panel Number of layers: 4 Surface finish: immersion silver Inner/outer copper thickness: 1/1oz Minimum via diameter: 0.3mm Minimum width/spacing: 0.162/0.1
4L PCB mit Senkung Key Specifications/Special Features: Surface treatment: hard gold (> =0.76um) Width/space: 5/4.5mil Impedance control: 55 ohms +/- 10% Countersink
6-Layer PCB mit Mindestlochgröße von 0,25 mm und C Key Specifications/Special Features: Material: FR4 Layer count: 6 Board thickness: 1.6mm Surface technique: imm. goldMinimum hole size: 0.25mm Applic
doppelte Seiten LED-FPC Layers Account: 1-8 layers Final Board THK: 0.075mm--4.0mm Min. board size: 6mm*10mm; Max. board size: 12.6*30m roll to roll base Material: PI,PET,PE
Double Side FPC Produziert von Rolle zu Rolle Layers Account: 1-8 layers Final Board THK: 0.075mm--4.0mm Min. board size: 6mm*10mm; Max. board size: Max:500mm*30m roll to roll base Material: PI,P
4L Multilayer Starrflex Boards Layers count: 4Flex layers count: 2Surface treatment: immersion gold Minimum hole size: 0.35mm Minimum line width/space: 0.125/0.20mmRigid board thic
Leiterplattenbestückung specializes in producing the various electronic products based on your customized designs The product field includes but are not limited to: Notebook
Einzelseite aus Aluminium basierte PCB Aluminum base boards for LED Layers: single side Material: aluminum base Four types thermal conductivity base material we can provide: 0.9 to 1.1, 1.
LED einseitig Aluminum PCB 1.5mm, 1 OZ copper LED Al-based PC
OEM / ODM PCB, Vergoldung, 6layers, BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
PCBA mit BGA SMT, PCB 6Layers BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
OEM / ODM PCB, Vergoldung, 6layers, BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
SMT Leiterplattenbestückung (BGA Verpackung) BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
OEM / ODM PCBA BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
PCB & PCB-Montage BAM Co. www(dot)ecbam(dot)com, provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO14000, R
OEM / ODM PCB BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
OEM / ODM elektronische PCB BAM Co. , www(dot)ecbam(dot)com, provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO14000,
OEM / ODM PWB-Brett BAM Co. , www(dot)ecbam(dot)com, provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO14000,
OEM / ODM PCBA BAM Co. , (www(dot)ecbam(dot)com), provide the excelent manufacturing for electonic assembly including PCB,SMT and DIP assembly with ISO9001, ISO1400
Doppelseite pcb (Communication Equipment) We offer as followingLayer: 1-22 Layers rigid PCB Base Material: FR-1, FR-2, 22F, CEM-1, CEM-3, FR-4, Aluminium base Board Thickness: 0.2/0.4/0.6/0
8 Lagen Starre Leiterplatten We are a professional manufacturer of PCBs of various kinds in Wenzhou,China. 1.Our Product range Single PCB;Double PCB;Multi-layer PCB,MCPCB,High fr
Double Side PCB We offer as followingLayer: 1-22 Layers rigid PCB Base Material: FR-1, FR-2, 22F, CEM-1, CEM-3, FR-4, Aluminium base Board Thickness: 0.2/0.4/0.6/0
Aluminium PCB We offer as followingLayer: 1-22 Layers rigid PCB Base Material: FR-1, FR-2, 22F, CEM-1, CEM-3, FR-4, Aluminium base Board Thickness: 0.2/0.4/0.6/0
Immersion Gold PCB We offer as followingLayer: 1-22 Layers rigid PCB Base Material: FR-1, FR-2, 22F, CEM-1, CEM-3, FR-4, Aluminium base Board Thickness: 0.2/0.4/0.6/0
Industrieautomation IMDSO11 Digitalausgang termi industrial automation digital output termination unit steady function guaranted quality remote technical support for fre
Aluminium-LED-Platine 1. Single sided aluminum pcb 2. Imported aluminium substrate and copper foil 3. High thermal conductivity 4. Surface finished: LF HAL 5. Min hole: 0
Einseitiger Aluminium-LED-PCB 1. Single-sided aluminium substrate pcb board. 2. 5052 Aluminium Alloy 3. Thermal Conductivity: 1.8 5.0W/m.k 4. Finished: OSP, HAL, Immersion gol
4 Schicht PCB-Kamera in Notebook-PC verwendet 1. 4 Layer pcb 2. Surface finished: OSP 3. Used in Notebook PC Camera 4. Min line width: 4mil 5. Min line space: 4mil 6. Min hole size: 0.25mm 7. Roh
Doppelseitige Leiterplatte mit 0,2 mm Dicke 1). Double sided pcb 2). Board thickness: 0.2mm 3). Surface finished: Platting hard gold 4). Min hole size: 0.2mm 5). Min Line width/space: 3/3mi
4-Schicht-Handy Schlüsselbrett 1. 4 layer pcb 2. used for mobile phone 3. surface finished: immersion gold 4. Rohs complian
6-Schicht HDI Leiterplatte für Handy 1. 6-layer pcb 2. Laser drilling, drilling structure is L1-L2, L2-L5, L5-L6, L1-L6 3. Surface finished: Immersion gold 4. Used for mobile phone 5. Ro
6 Schichten 4 Unzen dicken Kupferleiterplatten 1).6-layer board 2).copper thickness: inner layer--4OZ, outlayer---4OZ 3).Surface finished:Lead free HASL 4).Rohs complian
Halb PTH Loch bluetooth PCB 1. 6 Layer pcb 2. Laser drilling, Min hole size: 0.1mm 3. Surface finished: Immersion gold 4. Half PTH hole 5. Used: bluetoot
10-Layer-PCB mit Gold-Finger- 1. 10-layer 2. gold-finger board 3. 2.8mil line width and space 4. Min hole size: 0.25mm 5. Surface finished: Immersion gold + gold finger 6. Rohs c
8-Layer-PCB für Notebook Hauptplatine 1. 8-layer pcb 2. Notebook computer main board, 3. Low cost & quick delivery 4. Surface finished: Immersion gold 5. Min hole size: 0.2mm 6. Min
Red Printed Circuit Board Redprinted circiut boardprocesses capability information Material : FR - 4 Max board : 630mm x 530mm Board thickness : 0.6 3.5mm Board layers : 2
Vier-Schicht-OSP pcb four-layer osp pcbprocesses capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0.2 3.5m
Double-Layer-rotes Öl Bord double-layer red oil board processes capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0
rotes Öl pcb red oilpcbprocesses capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0.2 3.5mm·
rotes Öl red oil processes capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0.2 3.5mm·
Zweischicht-HASL pcb four-layer hasl pcbprocesses capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0.2 3.5
4-lagige Leiterplatten pcbprocesses capability information Material : FR - 4 Max board : 630mm x 530mm Board thickness : 0.6 3.5mm Board layers : 2 8 Min. drill : 0.25m
Double-Layer-blaue Öl Bord double-layer blue oil board processes capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness :
2-lagige Leiterplatte printed circuit boardprocesses capability information· Material : FR - 4 · Max board : 1220mm x 530mm · Board thickness : 0.2
Vier-Schicht-PCB four-layer pcbpcbprocesses capability information · Material : FR - 4· Max board : 1220mm x 530mm· Board thickness : 0.2 3.5mm
MCPCB
PCB Features: Applications: Excellent thermal conductivity. LED lighting. Excellent dimensional stability Thick film hybrid integrated circuits. Excllent
