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specializes in producing the various electronic products based on your customized designs The product field includes but are not limited to: Notebook PC Telecom audio and video Electronic security health and medical LED application test instrument Consumer electronicsEnabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality The operation we can handle for you is from the Bare PC board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement Our assembly competence: Stencil size/range: 736 × 736mm Minimum IC pitch: 0.30mm Maximum PCB size: 410 × 360mm Minimum PCB thickness: 0.35mm Minimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74 × 74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Frequency of stencil cleaning: 1 time/5 to 10 pieces E-mail us to find out how we can fill your requirements We sincerely hope we can become your supplier in Far East