XPC kupferplattierten Schichtfolie

SB-318 (XJ399) Copper clad laminated sheet consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil. Having high dimensional stability, good punching behaviour at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc. Standard: CPFCP-04, Equivalent to IEC-249-2-2, NEMA: XPC Technical requirements are shown in table 1 and 2 Table 1 Nominal thickness and toleranceNominal thickness mmTolerance at single point mm0.8±0.091.0±0.111.2±0.121.6±0.142.0±0.15Note: 1. Normal dimension: 1220±20mm×1020±20mm Table 2: Technical requirementsNo.ItemUnitConditioningNormal ValueTypical Value1Solder float at 260, min.sA10152Peel strength min.N/mmAS-5S/260-1.01.41.23Flexural strength min.MPaA801004Water absorption max.%E-24/50+D-24/23-1.85Dissipation factor max.-C-96/20/65C-96/20/65+D-48/50--0.050.106Dielectric constant max.-C-96/20/65C-96/20/65+D-48/50--5.56.07Insulation resistance min.MΩC-96/20/65C-96/20/65+D-2/100--5×104508Volume resistivity min.MΩ·mE-2/100C-96/20/65+C-96/40/9010100151809Surface resistance min.MΩE-2/100C-96/20/65+C-96/40/90301×103701.5×10310Thermal resistance-E-1/180-No blistering and peeling-off11Alkali resistance-5%NaOH, 40, 5min-Without notablechanges in apperance Remarks: ALL data listed in above table are typical values from SB-318 (XJ-399) CCL in thickness of 1.6mm and with copper foil of 35μm.