Vier-Schicht-Leiterplatten ENIG RoHS & WEEE

PCBProcessingDetails: FourLayerPCBBoardENIGRoHS&WEEE Certificate UL,ISO9001,ISO14001,RoHS,GJB9001A,WEEE BoardThickness 1.6mm UnitSize 148.82*94.5mm Layer 4 Material FR-4,TG135 SurfaceFinish ENIG(Ni>3μm,Au>0.03μm,TL=1.09dm²,BL=0.38dm²) Bow&Twist <0.70% MinThroughHole 0.3mm MinLineWidth 0.2mm/8mil MinLineSpace 0.28mm/11mil Test E-Test Packaging&Delivery: PackingDetails VacuumPlasticPacking,Carton DeliveryTime 12 21Days MaximumProcessCapabilityofOurCompany: 1 Layer 2-12 2 MaxProcessingArea 533*860mm21"*32" 3 MinBoardThickness 4LayerBoard0.40mm16mil 6LayerBoard1.00mm40mil 8LayerBoard1.20mm48mil 10LayerBoard1.60mm60mil 4 MinLineWidth 0.10mm4mil 5 MinLineSpace 0.10mm4mil 6 MinThroughHole 0.25mm10mil 7 MinHoleWallCopperThickness 0.025mm1mil 8 PTHDiameterTolerance ±0.10mm4mil 9 NPTHDiameterTolerance ±0.05mm2mil 10 HoleLocationTolerance ±0.05mm2mil 11 ExternalDimensionTolerance ±0.15mm6mil 12 MinSolderBridge 0.1mm4mil 13 Bow&Twist ≤1.5% 14 InsulationResistance 1012Ω 15 HoleResistance <300Ω 16 DielectricStrength >1.3KV/mm 17 CurrentResistance 10A 18 PeelStrength 1.5N/mm 19 SolderMaskRigidity >4H 20 ThermalShock 288°C20Seconds 21 Self-extinguishment 94V-0 22 TestVoltage 50-300V