TP300 Silikon thermische Pad thermisch leitfähigen Unterlage

silicone thermal pad/thermal gap filler/thermal conductive padTypical Applications: - Between electronic components such as Semiconductor,High Power IC, GPU, IGBT, MOS and heatsink. - Telecommunications infrastructure hardware (base stations),Telecom device, wireless Hub, power supply etc - High Power Led Lighting, Network Hardware, Automotive (Engine control modules, ABS systems... Typical Properties of TP300PropertiesUnitsMetric ValueTest MethodConstruction & Composition----With or without Fiberglass----Color----Light BlueVisualThickness Rangemm0.5 5.0----HardnessShore C25ASTM D2240Densityg/cc2.7ASTM D792Tensile StrengthKN/m0.3ASTM D412Elongation%64%ASTM D412Continuous Use Temp°C-40 to 150EN344Breakdown VoltageKv/mm≥5.0ASTM D149Volume Impedanceohm-cm1.1 x 1016ASTM D257Dielectric Constant1MHz7.15ASTM D150Weight Damnify----≤0.3%@150°C 240HFlame Rating----V-0UL 94Thermal ConductivityW/m.k3.0ASTM E1461UL, RoHS, REACH----Compliance----