TP080 Wärmeleitpad thermische Lückenfüller Pad Wärme c
original-Preis: 4,20 USD
Fiona Xiang
Kontaktperson
Basisdaten
| Ort der Herkunft | China |
|---|---|
| Marke | AOK |
| Modell-Nummer | TP080 Thermal pad |
| Geben | Isolierfolie |
| Anwendung | Hochtemperatur |
silicone thermal pad/thermal gap filler pad/thermal conductive pad Typical Applications: - Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink. - Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc - Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink. Specification Sheet: Typical Properties of TP080 PropertiesUnitsTP080Test MethodConstruction & Composition----Silicone & Ceramic filled----Color----GrayVisualThickness Rangemm0.5 12.0----HardnessShore C18ASTM D2240Densityg/cc2ASTM D792Tensile StrengthKN/m1.3ASTM D412Elongation%1.35ASTM D412Continuous Use Temp-40 to 150EN344Breakdown VoltageKv/mm≥4.0ASTM D149Volume Impedanceohm-cm1.7*1016ASTM D257Dielectric Constant1MHz4.51ASTM D150Weight Daminify----≤1@150 240HFlame Rating----V0UL 94Thermal ConductivityW/m.k0.8ASTM E1461UL, RoHS, REACH----Compliance----
Lieferbedingungen und Verpackung
Packaging Detail: Export Cartom Dimension:425x225x95mm Delivery Detail: 3 to 4 working days
Hafen: SZ
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