Talentierte Fertigung Technologie pcb Fabrik

Blank pcb with skillful manufacture technology: ItemTechnical SpecificationStandardAdvancedLayer count1-8 Layers10-16 LayersBase MaterialFR4, Teflon, Rogers, Aluminum, High TgFinish Board Thickness0.20 mm 3.20 mm0.13 mm 6.0 mm(8 mil 126 mil)(5 mil 236 mil)Minimum Core Thickness0.1mm(4 mil)0.08mm ( 3 mil)Copper ThicknessMin. 1/2 OZ, Max. 4 OZMin. 1/3 OZ, Max. 6 OZPTH Wall Thickness20um(0.8mil) min.25.4-38.1um(1-1.5mil)Min. TrackS/Sided0.100 mm ( 4 mil )0.08mm ( 3 mil)Min. SpaceD/Sided0.100 mm ( 4 mil )0.08mm ( 3 mil)Min. Hole Dia.Drilling /PTHφ0.2 mm ( 8 mil )φ0.10mm ( 4 mil)Punchingφ1.0 mm ( 40 mil )φ0.90 mm ( 36 mil )Dimension ToleranceHole Position±0.076 ( 3 mil )±0.05 ( 2 mil )Conductor Width(W)±20% Deviation of Master A/W±10% Deviation of Master A/WHole Dia.(H)NPTH: ±0.05 mm ( 2 mil )NPTH: ±0.03 mm ( 1 mil )PTH: ±0.075 mm ( 3 mil )PTH: ±0.05 mm ( 2 mil )Outline Dim.±0.13 mm ( 5 mil )±0.10 mm ( 4 mil )Surface FinishImmersion Gold, Immersion Silver, Immersion Tin, HASL, LF HASL, OSPSoldermask pitch0.1mm(5mils) min.0.08mm(3mils) min.V-CUTBoard Thickness0.50 mm (20mil) min.0.30 mm (12mil) min.Remain Thickness1/3 board thickness0.40 +/-0.10mm ( 16+/-4 mil )Tolerance±0.13 mm(5mil)±0.1 mm(4mil)Min. space - hole edge to tracePTH hole: 0.20mm(8mil)PTH hole: 0.13mm(5mil)NPTH hole: 0.18mm(7mil)NPTH hole: 0.10mm(4mil)Aspect ratio81101Thermal Shock3x10Sec@2883x10Sec@300Warp and Twist≤0.75%≤0.5%Electric Strength1.3KV/mmPeel Strength1.4N/mmInsulation Resistance10KΩ 20MΩ(typical:5MΩ)Conductivity<50Ω(typical:25Ω)Test voltage250VImpedance controlTypical: 50Ω+/-10%