SIM-Buchse
original-Preis: 0,16 USD
Jack Hong
Kontaktperson
Basisdaten
| Ort der Herkunft | Guangdong China (Mainland) |
|---|---|
| Marke | MUP |
| Modell-Nummer | C709 |
| Geben | SMB |
| Anwendung | PCB |
| Geschlecht | Weiblich |
SIM socket Technical characteristics 1.General characteristics Dimensions:24.60L*17.70W*1.80±0.10H mm Weight:0.60g Contact principle:Friction technology Operating position:shaft up/down/horizontal Mounting system:SMT(without post) Durability:5000 cycles min 2.Mechanical characteristics Insulation material:Thermoplastic,UL 94V-0 3.Electrical characteristics Number of contacts:6pins Contact resistance:50MΩ typical,1000 MΩ max Insulation resistance:>1000 MΩ/500V DC 4.Solderability Wave:not applicable Vaporphase:215oC,30sec Max IR reflow:230oC,15sec Max Manual soldering:360oC,3sec.Max 5.Environmental characteristics Operating temperature-40oC≈+85oC Operating humidity10%≈95%RH Storagetemperature:-40oC≈+85oC Storage humidity:10%≈95%RH Thermal shock: -40oCo≈+85oC,5cycles Damp Heat:40oC,90%RH,10days Salt-mist:35oC,5%Nacl,24H
Lieferbedingungen und Verpackung
Packaging Detail: 1.Reel packing.2.1000PCS per reel,6 reels per carton,one carton contain 6000PCS.3.The gross weight is 9.0KG.The net weight is 7.0KG4.The dimension of carton:36.00 L*33.00 W*36.00 HCM5.The volum is 0.05CBM,20 cartons is 1 CBM Delivery Detail: 1-2 weeks after confirm the order
Hafen: Shenzhen/Hongkong
Zahlungsbedingungen
Letter of credit
Telegraphic transfer
Western Union
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Zahlungsarten
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