Silikon-Wärmeleitpasten mit SGS & ROHS (ST

HEAT SINK COMPOUND/ THERMAL COMPOUND is a white paste silicone product which is heavily filled with heat-conductive metal oxides. The incorporation of high efficient heat-conductive metal oxides promotes high thermal conductivity, low bleeding, and high-temperature stability. This system is very stable to the change of temperature. It helps to maintain a positive heat sink seal that improves heat transfer from the electrical / electronic devices to the heat sink or chassis, thereby increasing overall efficiency of the devices. Applied industries: speciality electrics, electrical products. For example, cpu cooler, VGA cooler, refrigeration device etc.SpecificationParameterunitsconditionTest MethodTest ResultColorN/A25VisualGREYThermal ConductivityW/m-KNoROCT8.140-823.8Thermal Impedance-in2/W25ASTM D14700.087Specific GravityN/A25ASTM D14752.5Evaporation%150/24HoursFed.Std.7910.001Bleed%150/24HoursFed.Std.7910.05Dielectric Constant AN/A100HzASTM D1505.1ViscosityN/A25____no flowingThixotropic Index1/10 mm25GB/T-269380±10N/AN/A-50 240Operation TempertureN/AN/A-30 180ComponentSilicone Compounds50%Carbon Compounds20%Metal Oxide Compounds30%