Silikon-Thermal-Pad Wärme Lückenfüller pad therma
original-Preis: 2,00 USD
Fiona Xiang
Kontaktperson
Basisdaten
| Ort der Herkunft | Guangdong China (Mainland) |
|---|---|
| Marke | AOK |
| Modell-Nummer | UTP100/TP080 Series thermal Pad |
| Geben | Isolator |
| Anwendung | Hochtemperatur |
Thermal pad /thermal gap filler pad/thermal conductive pad Applications: - Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink. - Led Lighting, LCD TV, Telecom device, Wireless Hub,Power supply etc - Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink. Specification sheet Typical Properties of UTP100 PropertiesUnitsMetric ValueTest MethodConstruction & Composition----Silicone & Fiberglass----Color----pink & whiteVisualThickness Rangemm0.5 12----HardnessShore C10ASTM D2240Densityg/cc2.0ASTM D792Tensile StrengthKN/m2.5ASTM D412Elongation%60%ASTM D412Continuous Use Temp°C-40 to 150EN344Breakdown VoltageKv/mm≥6.0ASTM D149Volume Impedanceohm-cm6.2 x 1015ASTM D257Dielectric Constant1MHz5.27ASTM D150Weight Damnify----≤1@150°C 240HFlame Rating----V-0UL 94Thermal ConductivityW/m.k1.0ASTM E1461UL, RoHS, REACH----Compliance----
Lieferbedingungen und Verpackung
Packaging Detail: Cartom:225*425*95mm Delivery Detail: 3 5days
Hafen: SZ or HK
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