RW-B500C BGA Schweißgerät

BGAWelding Machine-RW-B500C Advantage: 1. Auto-generated profile, multi steps of temperature control 2. Embedded industrial computer, PLC with stable performance 3. big bottom IR area movable with X axis 4. Applicable for laptop,desktop,xbox,ps2, ps3,psp,etc. Warranty: 1 year, during the warranty, if any parts are damaged not artificially, our company will afford to replace a new one for you and the relative shipping cost is on our party. Specification PCBdimensionW50×D50 W680×D680mmPCB thickness0.5 4mmTemperature controlK-type thermocouple, close cycle controlledPCB locating wayJigPreheaterfar infrared 2400WUpper heaterhot air 400WLowerheaterhot air800WPower supplysingle-phase 220V, 50/60Hz, 4KWMachine dimensionL750×W780×H700mmWeightApprox 70Kg Features High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled;Auto-generated profile, no need to adjust or change temperature on the profile;Adjustable Airflow and temperaturewithin a wide range to produce high temperature breeze;Movable heating head for easy operationTouch screen interface; 3 heaters;real-time temperature curve display on touch screen;Embeded industrial computer, PLC control; able to disply set profile and testing profileat the same time; analyze the profile,compared with saved history profiles;8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving;Up/down adjustable lower hot air nozzle; Buzz after soldering or desoldering is finished;With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements.The whole bottom IR preheating area can move along with X axis, so as to meet the need of different BGA repair and bigger size PCB.