Niedrigen Schmelzpunkt Thermische Klebstoffe

The Low Melting Point Thermal of TIC™800P Series islow melting point thermal interface material. At 50°C, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130°C,or after 500 cycles, from -25°C to 125°C.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.Features 1.0.024°C-in² /W thermal resistance 2.Naturally tacky at room temperature, noadhesive required 3.No heat sink preheating requiredApplications 1.High Frequency Microprocessors 2.Notebook and Desktop PCs 3.Computer Serves 4.Memory Modules 5.Cache Chips 6.IGBT