Mutilayar pcb

SPECIFICATION OF PCBCountry of Origin:China (mainland)Vendor to be UL recognized to minimum category of 94V0Fabricated in accordance with IPC-A-600,latest version unless otherwise specified in attached specification.All patterns according to Customer PCB Artwork/Gerber File.Material:FR-4 not specified supplier,customer maybe choose ShengYi,KB,Nanya,etc..We would provide a copy of UL materials certificate.This is a4LayerWeight of Copper: 1 oz per sq .ft(Base Material)for Outer Layers. Finish to be 2oz per sq.ft oz per sq.ft(Base Material)for Inner Layers.Finished Board thickness shall be(Tolerance is ±10%):0.8mm 1.0mm 1.2mm 1.6mm OtherVia Method: PTH Blind Via between layerPCB will be identified with MFR’S approval logo, type designation week and year(WWYY) OF MFR and Customer P/NMFR’s UL Logo&indicated location According to PCB Drawing of Gerber dataDate code location: Print on Top/Bottom Side Silkscreen LayerEtch on Top/Bottom Side Copper Layer.Customer Part No.&Silkscreen Layers According to PCB Drawing or Gerber data indicated location.All PCB will be electrical tested before shipmentOther Test and Reliability standard refer to IPC-A-600(latest version)PCB Class1 Class2 Class 3As per ion-contamination test results.(IPC-TM-650 Test Method2.3.25)Finishing: HAL ENTEK Pre-flux Gold Flash Gold Plating Immersion Tin Immersion Silver Immersion gold etc...Min. hole size: 6mil or mm(Remark: The minimum hole size are for drill bit size)Legend Silkscreen: Top or Bottom sideLegend marking do not allow printed on soldering pad and must keep clearance 10 mil min,leave to the soldering padSilkscreen color: White Yellow Black etc...We will provide specification & Materail Safety Data Sheet(MSDS) of legend inkSoldermask: Wet film Dry film Conventional PeelablePlug all via holes by soldermask on Top Side or Bottom SideSoldermask color: Green Blue Yellow Red OtherFabrication: Routing Punching HandmadeAll sample board and risk buy order will be acceptable for routingComply RoHS standardPacking: PCB will be cleaned and dried to insure storage for 180 days in the unit package without corrosion, visible fingerprints, oxidation, mold or loss of solder ability. All boards shall be packaged in such a manner as to prevent board-to-board damage and/or damage from external cause. Paper interleaving is preferred, and if used, must be free of sulfites and other materials which will contaminate the board surface.Electrical Test :No open/short circuits (Must be test in PP samples) All conductor paths must be tested for continuity and for shorts to all other conductors.The nets must be tested continuity at the plated through hole or surface mount pads.The maximum resistance must be 10 ohms or less.The minimum resistance must be 1M ohms at 100VDC or 2M ohms at 250VDC.E-test Mark Must be present after Electrical Test.Hole Sizes :Guide Holes -Measuring all, all according to Fab Dwg.Outline Dimensions: All dimensions according to Fab DwgGuide Holes Locations: All guide holes locations according to Fab DwgV-Cut: Distance of 2 V-Cut tips along H-plane of PCB <= 0.1mm Distance of 2 V-Cut tips along V-plane of PCB <= 1/3 T, where T = thickness of PCB, unless otherwise specified by Fab DrawingBow and Twist: Placing both sides in a flat surface, the highest point of both sides to the diagonal length < 1% for non-SMT and < 0.75% for SMT PCBs.