Multilayer-Leiterplatten

Our printed circuit boardgot UL,SGS,ISO9002,RoHS,QS9000 and TS16949 certificates,and are used to a wide range of fields such as computers, digital products,medical equipment, automobiles, communication devices, military, industrial control and aviation. Printed Circuit Boardprocess capability layer:2-22 layerproduct type:Rigid PCB,High Density Inverter PCB,thick copper PCBMaterials:FR-4, CEM-3, Teflon, Aluminum, Rogers, High TgCopper Thickness:140micron(4oz)Min Board Thickness:0.4mmMax Board Thickness:5.0mmMin finished Hole Diameter:0.1mmOuter layer line width / spacing:0.1mm/0.1mmInner layer line width / spacing:0.1mm/0.1mmMin aperture:0.2mmMin Laser drilling:0.1mmMin Ring Width:0.11mmMin BGA-bit hole spacing:0.4mmResistance Tolerance:±10%Min Insulation Thickness:3milMax laser blind hole thickness to diameter ratio:0.8:1Maximum working board size:520*622mmDrilling Tolerance (PTH):±0.075mmDrilling tolerance (NPTH):±0.05mmOutline Tolerance (CNC):±0.13mmSurface finished :Lead Free HASL, HASL, Gold plating , Immersion Gold\Tin\Silver, OSP, Gold Finger Plating,Carbon Ink Printing Printed Circuit Board production capacity Double sided PCB :200000 ft2 /Month Multilayer PCB :320000 ft2/Month HDI PCB : 80000 ft2/Month All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please feel free to contact us.