lelectronic Bauteile, Leiterplatten, Leiterplattenbestückung, componen
original-Preis: 0,50 USD
Maggie Li
Kontaktperson
Basisdaten
| Ort der Herkunft | Guangdong China (Mainland) |
|---|---|
| Marke | OEM |
| Modell-Nummer | MTP-003 |
1. Layer: 1-30 2. Board finished thickness:0.21mm-7.0mm 3. Material: FR-4,CEM-1,CEM-3, High TG, FR4Halogen Free, Rogers 4. Max. finished board size: 23-25(580mm*900mm) 5. Min. ldrilled hole size: 3mil(0.075mm) 6. Min. line width: 3mil(0.075mm) Min. Line spacing: 3mil(0.075mm) 7. Surface finish/treatment: HASL/HASL lead free, HAL, 8. Copper thickness in hole: >25.0um.(>1mil) 9. Inner Packing: Vacuum packing/Plastic bad Outer packing: Standard carton packing 10. Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076,NPTH: ±0.05 11. Certificate: UL, ISO9001, ISO14001,SGS,RoHS 12. Special requirements: Buried and blind vias +controlled Impedance + BGA 13. Profiling: Punching, Routing, V-CUT, Beveling 14. Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
Lieferbedingungen und Verpackung
Packaging Detail: common package Delivery Detail: 3-7days
Hafen: Shenzhen
Zahlungsbedingungen
Letter of credit
Telegraphic transfer
Western Union
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Zahlungsarten
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