LED-Leiterplatte

Technical Capability Layers: layers: single-side al substrate, double-size al substrate, four layer al substrate Surface disposal: spray tin, chemical tin, chemical gold, osp.immersion tin, Mazimum measurement:1100*480mm Minimum measurement:5*5mm Line width: 0.1mm Warp and twist: <0.5%(thichness: 1.6mm,measurement:300*300mm) Processing Thickness: .3-4.5mm Molding dimension tolerance: +/-0.15mm V-cut positioning accuracy:+/-0.1mm Processing capability:6000squaremeter Aperture location deviation: +/-0.07mm Minimum diameter of piercing: <1.0mm Minmum specification of the square grove: plate thickness lower than 1.0mm, 0.8mm, Circuit Printing deviation:+/-0.076mm Scope of molding dimension tolerance: cnc +/-0.1mm punching the shape:+/-0.15mm Mini aperture: 0.8nn not limited to the maximum aperture diameter Coating thickness: gold plating: ni2.5-5um au:0.05-0.1um.0.025-0.075um Immersion gold: ni5-8um. Au0.08-.1um Spray tin:3-3um.4-3um V-cut angle deviation: +/-5degrees Scope of V-cut plates: 0.6mm-3.2mm Marking font of the smallest components: 0.15mm Smalles windowing of pad: 0.01mm