Laptop thermal pad Features&Benefits: 1.Thermal conductivity:2.0W/m.k 2.High conformability and low hardness 3.Electrically insulating Typical Application: 1.Laptop,modulein computer 2.Between electronic components such as Semiconductor,IC,CPU,MOS and heatsink 3.Cooling Module,Thermal module,in all applications where metel housing is used as heatsink Configurations: ·Standard size for sheet form:200x400mm ·Thickness:0.25-6.0mm