Keramiksubstrat

aluminaCeramicsubstrate, alumina wafer, alumina substrate The high precision laser cutting processing installations can used for scribing,cutting and drilling ceramic substrates (Minimum hole diameter:0.2mm).Laser cutting method allows to produce ceramic substrates with various outside contour geometries,hole patterns,cut-outs and snap-lines. Benefits: ·High cutting accuracy, very small tolerance. ·Eliminating the time-consuming and costly tool fabrication stage. ·As well as increasing the goods supply efficiency by a big margin and shortening the processing circle. size: produce as your requirement