Grünes Siliciumcarbid-Mikro

Green Silicon Carbide to the finest powder, in custom sizes, to meet all our customers' needs. It is manufactured by a team of professionals dedicated to providingour customers the best in quality, service and support.Xindaxin has special abrasive powder for wire-sawing semiconductor material, which is different from traditional SiC abrasive powder, manufactured through many strict working procedures, and under 12 quality control targets. The products havethe characteristics of high purity, high hardness, narrow distribution, good grain shape, no coarse grains and can reach high quality requirement. It is usedfor wire-sawing 3-8 inch single-crystal silicon, solar cell multi-crystal silicon, gallium arsenide, quartz crystal and etc.. The powder is the engineering material for semiconductor and solar cell industries. It can improve cutting efficiency,reduce production cost, and guarantee the quality of the wafers.