Elektronische Chipbefestigungssilberpaste

It is designed for LED die attaching process; particularly for plating transfer (pin transfer and back coating process) die attaching process. The stable manufacturing quality under ISO system ensures the good workability and application performance. Advantages Adopting advanced semiconductor packaging adhesive technology, which is halogen-free and non-heavy metal formula with features of good workability, good conductivity, moderate baking temperature, strong adhesion. APPLICATION GUIDELINES PACKING Product is packed into plastic syringes or jars, and the one customer require. The quantity are 10ml (syringe, 30g), 30ml(syringe, 90g), 300ml(jar,1pound ). SHIPMENT This product is packed and shipped in proper amount dry ice at -80°C. If the dry ice has disappeared during the shipment, the product quality maybe changes. If so, please contact Nonfement for advice. After shipment, please place the product in freezer at -40±1°C. STORAGE This product must be stored at -40±1°C for good shelf life and quality. Incorrect storage conditions will degrade the performance of the material in both handling and final cured properties. The container has to be placed in the right way. THAWING Allow the container to reach room temperature before use.10CC package needs 30 minutes to warm up, and 30CC needs 1 hour, 500ml needs 2 hours. Do NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. Do NOT re-freeze. Once thawed to room temperature, the adhesive should not be re-frozen. ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product’s recommended work life. Apply enough adhesive to achieve a proper wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die.