Electronic Manufacturing Service für Stromversorgung

Number of layer: double layer Layers:4layer Laminate material: FR-4, Base board thickness: 4.0mm Surface finishing: OSP, HAL, immersion AU, silver, soft Au, nickel plating and gold finger Twist: 0.5% Insulation resistance: 10Ω (11Ω) Test voltage: 150 to 300V Thermal cycling ability: 288°C, 5 seconds Finished board area: 560 x 610mm Minimum line width and spacing: 0.1/0.1mm Copper thickness in hole: 25μm Minimum pad diameter inner layer: 0.5mm