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FR-4 material, Single layer board Surface Processing: Gold-finger Lead-free-Hal Excellent quality Competitive price Outstanding Service 1) The base Material: FR-4 / Flexible board, Other material: FR-5/ Tg170/ Polyclad / Rogers / Teflon/ Aluminium Base material 2) Max Copper Thickness: 6OZ (210um) 3) Finished Board Thickness: 0.15mm 7.5mm 4) Layers: 2 Layers 50 Layers 5) Max Production Panel Size (L*W): 1092 mmX 762 mm (43X30 sq inch) 6) Minimum Internal Layer Line/space: 3mils/3mils 7) Minimum Laser Blind Via Hole size: 0.10mm (4mils) 8) Max Aspect Ratios: 15: 1 (hole size: 0.25mm) 9) Min. Solder Mask Bridge: 0.050mm(2mils) 10) SMT Pitch: 0.25mm (10mils) 11) Impedance Control: +/- 5% 12) Surface Processing: HAL, Lead-free-Hal, Flash Gold, Thick Gold, Immersion Gold/Silver/Tin, Gold Finger plating, Pre-flux(Entek), OSP, Seletive ENIG 13) Solder Mask Types: Liquid Photo-Imageable(W/F), Conventional S/M, UV S/M 14) Profile: CNC Routing, Punching, V-Cut 15) Special-Tech: Blind and buried via \ Backplane \ HDI: 1+N+1, 2+N+2 \Impendance control Back Drilling\ Bury Resistor \ Bury Capacitor \ Mix Pressing \ Step Slot&Step Boards