Doppelseitige Leiterplatten

SPECIFICATION OF PCB l Country of Origin:China (mainland)l Vendor to be UL recognized to minimum category of 94V0l Fabricated in accordance with IPC-A-600,latest version unless otherwise specified in attached specification.l All patterns according to Customer PCB Artwork/Film/Gerber File.l Material:FR-4 otherl We would provide a copy of UL materials certificate.l This is a Single Layer Double Layer 4Layer Otherl Weight of Copper: 1 oz per sq .ft(Base Material)for Outer Layers. Finish to be 2oz per sq.ft oz per sq.ft(Base Material)for Inner Layers.l Finished Board thickness shall be(Tolerance is ±10%):0.8mm 1.0mm 1.2mm 1.6mm Otherl Finishing according to IPC-TM-650(2.2.13)latest version.l Via Method: PTH NPTH Blind Via between layerl Carbon TH No crack, no unblocked holesl Sliver TH-Less than 30% of the front view area of the silver through hole unblocked.l PCB must be identified with MFR’S approval logo, type designation week and year(WWYY) OF MFR and Customer P/l MFR’s UL Logo&indicated location According to PCB Drawing of Gerber datal Date code location: Print on Top/Bottom Side Silkscreen Layerl Etch on Top/Bottom Side Copper Layer.l Customer Part No.&Silkscreen Layers According to PCB Drawing or Gerber data indicated location.l All PCB will be electrical tested before shipmentl Other Test and Reliability standard refer to IPC-A-600(latest version)PCB Class1 Class2 Class 3l As per ion-contamination test results.(IPC-TM-650 Test Method2.3.25)l Finishing: HAL ENTEK Pre-flux Gold Flash Gold Plating Immersion Tin Immersion Silver Immersion goldl Min. hole size: 12mil or mm(Remark: The minimum hole size are for drill bit size)l Legend Silkscreen: Top or Bottom sidel Legend marking do not allow printed on soldering pad and must keep clearance 10 mil min,leave to the soldering padl Silkscreen color: White Yellow Blackl We will provide specification & Materail Safety Data Sheet(MSDS) of legend inkl Soldermask: Wet film Dry film Conventional Peelablel Plug all via holes by soldermask on Top Side or Bottom Sidel Soldermask color: Green Blue Yellow Red Otherl Fabrication: Routing Punching Handmadel All sample board and risk buy order will be acceptable for routingl PCB Unit/Panel size:163.3X215.6inch/mml Comply RoHS standardl Packing: PCB must be cleaned and dried to insure storage for 180 days in the unit package without corrosion, visible fingerprints, oxidation, mold or loss of solder ability. All boards shall be packaged in such a manner as to prevent board-to-board damage and/or damage from external cause. Paper interleaving is preferred, and if used, must be free of sulfites and other materials which will contaminate the board surface.l Pattern Comparison :All patterns according to PCB Artwork/Film/Gerber File.l Trace & Space Width Within ±20% per artwork.l Conductor Nicks, scratches or pinholes < 20% of nominal widthl Pads :Nicks, scratches or pinholes < 20% of nominal width No lifted or damaged pad No dewetting, excessive solder or exposed copper for HAL .No decoloration, oxidation or exposed base metal for Au No scratch or exposed copper for carbon .Holes No block hole or extra hole on board No crack or excessive solder inside hole for PTH Annual ring, 0.1mm Min. for component hole and 0.05mm Min. for via hole No plating on Non-PTH walll Solder Mask ,No scratch, conductor exposed or foreign matter under solder mask.Solder mask on edges of non-soldering pads remains 80% of pad area.Solder mask on edges of soldering pad remains 80% of pad area for silk-screen method.No solder mask on all soldering pads for wet film method.No solder mask on all soldering pads except pad edges for all methods.Qualified and confirmed to requirement of IPC-SM-840, Class 2.Minimum thickness should be 0.0004 In. (0.01mm).l Legend No illegible marking, mis-alignment or missing/extra marking No on pad except PTH Registration must be within 0.010 In. (0.25mm) of the silkscreen master pattern.Epoxy ink must be nonflammable,non-conductive, non-hydroscopic and able to withstand the wave soldering or SMT reflow soldering and post cleaning operation. Contact Finger No defect found on the central portion of the 80% finger area No Solder and Soldermask allowed on Contact Finger. Not allow exposing Nickel or Copper Base Material on Contact Finger.l Electrical Test :No open/short circuits (Must be test in PP samples) All conductor paths must be tested for continuity and for shorts to all other conductors.The nets must be tested continuity at the plated through hole or surface mount pads.The maximum resistance must be 10 ohms or less.The minimum resistance must be 1M ohms at 100VDC or 2M ohms at 250VDC.l E-test Mark Must be present after Electrical Test.