Doppelseitige Leiterplatten

SpecificationItemTechnical ParametersMin Leiterbahnbreite / Raum (Mil) 3-4min Loch SizeBoard Thickness≤1.6mm0.2mmBoard Thickness≥1.6mmAspect Verhältnis: 10max layer28-layerMin Annular Ring WidthVias: 4MilComponent Vias: 4MilMin Vorstands ThicknessDouble-sided0.1mmMultilayer4-6 Layers: 0.4mm8 -12 Ebenen: 1.0mm14-18layers: 1.2mm20layers: 1.6mmMax Bord thicknessDouble-sided609mmx609mmMultilayer550mmx500mmDrilling ToleranceLocation: ± 3MilPosition: ± 2MilOutline Toleranz ± 0.1mmMin.PTH Coper Wall15umBowTwist <1% Entfernung zwischen Leitungs- und Vorstands EdgeOutline: 0.10mmV-CUT: 0.40mmSolderMask Window3MilMask Bridge4MilColorWhite, schwarz, green.yellow, red.etc.Surface PlatingHAL, PlatedNi / Au, ImmersionNi / Au / Ag, gold Finger.etcPlating Dicke (Mikrozoll) TechniquesPlatingTypeMin.ThicknessMax.ThicknessPlatedNi / AuNi Thickness120400Au Thickness130ImmersionNi / AuNi Thickness120200Au Thickness110Gold FingerNi Thickness120400Au Thickness130Board MaterialsFR-4, hohe TG, Aluminium-basierte, Dickkupfer, Rogers, etc.