Die Überarbeitungsstation für ACHI IR 6000

BGA rework station ACHI IR-6000 ACHI IR6000 type BGA soldering Rework station in Esino Internation Development Ltd. based on the original product IR3000 developed a dark red outside the BGA rework equipment. Applicable CBGA, CCGA, CSP, QFN, MLF, PGA, μBGA and all green epoxy chip-level classes such as welding, repair. Products designed primarily for laptops, desktops, switches, XBOX, PS3 and other game consoles, motherboards and other communications equipment category BGA chip, shielding and other repair, welding in the field. Features: machine design with integrated design, rework station more integrated, smaller area occupied table, no messy cables, repairing a key control process, the operation easier. Strongly to create a split-type slide-type BGA Rework platform support. Can be very easily fixed PCB board, effectively prevent the deformation of PCB board. And function to meet more needs. Top heating head can be adjusted by rotating the handle, fixed height. Upper heating a large area can easily repair a wide range CPU Block, shielded enclosures, replacement of various components slot. Innovative design, effective solution to common infrared rework station vulnerable to the effects of air flow lead to rise slowly, the temperature control. Maximum temperature up to 400 °C, easily handles lead-free solder rework. Upper and lower temperature zone independent temperature measurement. Contact temperature sensor can capture accurate, real-time temperature parameters BGA heat. Truly closed-loop control, the welding is completed with alarm function. And automatically cut off the heating power. IR6000 to connect to a computer to control more convenient, built-in PC serial port and a proprietary IRsoft software to connect to it. Temperature can be set to 8 +8 section temperature control curve, can store 10 sets of temperature curves. Power: 1300W Voltage: 220V 50 HZ NW: 13KG GW: 18KG Specification: 475 mm × 480 mm × 420 mm