COG Bonding Maschine

Key Feature: Japanese controlling system and precise servo system. Precise linear modules auto-bonding IC and alignment. High clearance CCD alignment vision system, cross mark alignment. Precise micrometer adjustable X-Y-θaxial of fixture. automatic capture the mark and its matching by softwareBasic Parameter Voltage: AC220V 50-60HZ Rating Power:1000W Pressure:0.4-0.8Mpa Operation Mode: 7" interface Work Mode: automatic Alignment System: Cross mark position Aligning Accuracy: ±5um Bond Head: L:30mm W:4mm (Customization) Ambient Treatment: FFU high efficient filtration(optional) Fixture: Micrometer adjust X-Y-θaxis Weight:450kg Dimension:(L)880 x (W)970x (H)1380mm Machine parameter and specification made to customer request