Beste günstigste Wahl! ZM-R5850CRBGA Nacharbeit / Reparatur

BGA ReworkEquipment ZM-R5850C Features: 1. Unique design of three heating areas operating independently to control temperature more accurately. 2, First / second temperature areas heat independently, which can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at the same time. 3. The third area uses far-infrared heater to preheat and control the temperature independently, so that the PCB can be fully preheated during the desoldering process and it can be free from deformation. 4. Choose imported high-precision K-Sensor and closed-loop to detect the up/down temperature precisely. 5. After finishing desoldering & soldering, there is an alarming. When the temperature goes beyond control, the electric circuit can cut off automatically , with over-heating protection. 6. Use a powerful cross-flow fan to cool the PCB rapidly to prevent it from deformation and ensure the welding effct. 7. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled. 8. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it. 9. For large thermal capacity of PCB/CSP/QFP or other high-temperature and lead-free welding requirements, all can be handled easily. 10. The hot air nozzle can rotate 360 ° freely and it's easy to replace. Offering BGA nozzles of different sizes for you to replace easily. Nozzles of special requirements are customzible.11: Camera+LCD=observe bga chip working situation. easy to control and calibrate