Beryllium-Kupfer (BeCu, C17200 C17500, Kupfer bery

1. Beryllium copper mold material has excellent electrical conductivity, thermal properties, 2-3 times higher than steel, excellent cooling performance, to shorten the cycle time on molding, good heat dissipation, effectively reducing product shrinkage deformation and the degree of control of beer After plastic shrinkage and improve dimensional stability, increase productivity. 2 high corrosion resistance, especially for polyethylene (PVC) products of mold: 3 high hardness, wear resistance and toughness, as inserts and mold components used copper and aluminum molds for maximum performance can extend the life of mold 4 excellent polishing performance can be obtained with high precision mirror surface and shape of complex patterns, 5. Anti-stick performance, easy and other metals welding, easy machining and no additional heat treatment. 6. Non-magnetic and shock no spark, used in petrochemical, metallurgy and mining production of explosive.