Automatische Optische Prüfeinrichtungen

TheAOIis applicable to electronic products manufacturing equipment, textile equipment and materials industries. When the automated optical inspection, the device automatically scans through the camera PCB, capture images, the test solder joint with the database to compare the parameters of qualified, after image processing, check out the PCB on the defect, and through displays or automatically mark the defect display or marked for repair maintenance personnel. 1, pick and place circuit board to facilitate a) barrier-free type of splint device, making the circuit board pick and place convenient, patented design of boundless card board device that can clamp the circuit board components, zero margins. 2, asynchronous test function a) to confirm test results may be artificial, while a circuit board to commence the next test, saving test time. 3, replacement parts for functional a) a single component can have multiple standard templates set up to deal with incoming batches of the same batch of welding 4, arbitrary selection of MARK-point a) In addition to the traditional circular, rectangular, cross, triangle symbol as the MARK point, you can also use any sign of a feature as the MARK point. 5, arbitrary angle measurement a) all the components, solder pin, solder, as well as the bridge test, can be tested by any angle. 6, automatic path optimization a) camera walking position, are based on intelligent machine learning methods to optimize the path set up to ensure the camera with the shortest and fastest way to be tested. 7, IC pin, and automatic segmentation of discrete components, foot welding a) Automatic Segmentation of IC pins and solder discrete components and can automatically set foot in all the test parameters pin. Avoid the set-by-pin solder volume and short-circuit the window of trouble.