512 MB DDR2-Speicher RAM

ddr2 memory ram.512m memory ram Specifications: 1) DDR2 533,667,800MHZ 2) 184-pin socket type dual in line memory module (DIMM) 3) 2.6V power supply 4) Data rate: 400Mbps (max.) 5) 2.5 V (SSTL-2 compatible) I/O 6) Double data rate architecture, two data transfers per clock 7) Bi-directional, data strobe (DQS) is transmitted/received with data, to be used in capturing data at the receiver 8) Data inputs and outputs are synchronized with DQS 9) DQS is edge aligned with data for READs, center aligned with data for WRITEs 10) Differential clock inputs (CK and CK) 11) DLL aligns DQ and DQS transitions with CK transitions 12) Commands entered on each positive CK edge, data referenced to both edges of DQS 13) Auto precharge option for each burst access 14) Programmable burst length: 2, 4, 8 15) Programmable/CAS latency (CL): 3 16) Programmable output driver strength: normal/weak DDR 533MHZ-PC3200 180PIN 256MB 32*8/16*16 /TSOP PC /RETAIL PACKING DDR 533MHZ-PC3200 180PIN 512MB 64*8/32*8/32*16/TSOP /PC RETAIL PACKING DDR 533MHZ-PC3200 180PIN 128MB 16*8 /TSOP PC RETAIL PACKING DDR2 667MHZ, 16X64/BGA /PC/RETAIL PACKING Quality control 1. IC chipset test ICchipsets we utilizes are only top grade from original brands, like HY,Samsung, Elpida, etc. When new IC chipsets are received, we randomlychose samples for test, approximately 10% to 20% ratio, on profestionaltest software---RST. Only if the samples are all withouth problem, thisbatch of ICs can be sent to the next test; 2. SPD infomration test of the Module Tocheck whether the SPD information is correct, we use two professionalsoftwares, CPU-Z and Sisoft Sandra 2007, to separately test the module.During this procedure, we subject to internationl stardard AQL to picksamples. 3. Compatibility test of the Module Samples which arepicked according to AQL standard will be installed on more than 200mainstream brands of motherboards, like Asus, Intel, etc. 4. Stability test Picksamples according to AQL standard. Only after continous work WITHOUTCRASH for 48hours individually at 70 degrees centigrade and -10degrees centigrade under big software like 3DMARKS, big games, etc, theModule can be sent out of the factory.