4layer Platine

ItemTechnical CapabilitySample or PrototypeMass productionProduct typesRigid PCBRigid PCBHeavy Copper PCBHeavy Copper PCBAluminum-based PCBAluminum-based PCBCopper-based PCBCopper-based PCBBoard finishing typesImmersion Gold/Tin/SilverImmersion Gold/Tin/SilverHAL, HAL (Pb-free)HAL, HAL (Pb-free)OSP, Gold FingerOSP, Gold FingerGold Flash, Carbon InkGold Flash, Carbon InkAvailable laminatesFR4 & High TgFR4 & High TgHalogen free FR-4Halogen free FR-4Metal based clad laminateMetal based clad laminateRogersRogersNo. of layers1--101--10Base copper thickness0.5 to 7oz (18um to 245um)0.5 to 6oz (18um to 210um)Board thickness0.20-5.0mm0.25-5.0mmMax. panel size400mm x 800mm540mm x 620mmMin. finished hole size0.10mm0.10mmHole size tolerancePTH0.076mm0.076mmNPTH0.05mm0.05mmHole to hole tolerance+/-0.05mm+/-0.05mmAspect ratio10:1(Max.)8:1(Max.)Copper thickness in hole0.02-0.035mm0.02-0.035mmMin. line width/space0.10mm/0.10mm0.10mm/0.10mmMin. space between hole to track0.15mm0.15mmSolder maskLPI solder maskLPI solder maskPeelable maskPeelable maskMin. solder mask pitch0.08mm0.08mmMin. solder mask window0.05mm0.05mmSolder mask thickness0.4mil-0.8mil0.4mil-0.8milMin. annular ring width0.05mm0.05mmGold thicknessImmersion gold2u" to 4u"2u" to 4u"Gold flash/ Hard gold1u" to 5u"1u" to 5u"Gold finger0.75micron0.25micronNickel plating thickness150u" to 200u"150u" to 200u"Outline profilePunching, RoutingPunching, RoutingPunching + Push backPunching + Push backOutline tolerance+/-0.10mm+/-0.10mmTwist and bow0.5-0.75%0.75%Impedance control+/-10%+/-10%