2 Schritten mit hoher Dichte (2 + 2 + 2)

1Layers count2-22 layers2Finished Board Thickness16 134mil(0.4mm – 3.4mm)3Max. panel size21.5” × 24.5” ( 622mm × 546mm )4Available Laminates MaterialFR-4, CEM-3, Aluminum-based, High Frequency, High Tg, High CTI,Teflon, Halogen Free. Lead free compatible5Finished board Thickness tolerance≤1.0mm ±0.10mm (±4mil) 1.0 1.6mm ±0.15mm(6mil)6Min.Line Width/Spacing3/3mil (0.075/0.075mm)7Copper foil thickness12u,18u,35u,70 u,105u,140u,175u,210u (1/3oz-6oz)8Min. finished hole size0.15mm (6mil)9Min. drilling bit size0.20mm10Max. drilling bit size6.30mm11PTH,NPTH± 0.08mm (±3mil);± 0.050mm (±2mil)12PTH hole copper thickness>=25um (1.0mil)13Max. Aspect ratio6/114Impedance Control±10%15Min. solder mask opening0.05mm (2mil)16Min. Solder mask coverage0.05mm (2mil)17Surface FinishedOSP,Gold plating,Gold finger,Tin plating,ENIG,carbon ink,Immersion silver,ImmersionTin,HASL(lead free).18ENIG thicknessNi: 2.54-6um / Au: 0.05-0.15um (100 238U" / 2 6U")19Immersion silver8-12U" (0.20um-0.30um)20Immersion Tin0.8 1.2um (31.5 48U")21OSPENTEK PLUS HT:0.3-0.5um ; F2:0.15-0.3um22V-Cut angle30°,45°,60°23Min. V-cut board thickness0.4mm24Gold finger Chamfer angle20°,30°,45°25Profiling modeRouting & Punching26profiling tolerance± 0.10mm (4mil)27E-Test voltage250 ± 5V28Max. E/T Insulation resistance100 MΩ29Min. E/T conductive resistance10Ω