10-Layer (Gold-Finger) PCB

Specifications: Layer:10-layer Thickness:1.6mm FinishCoating:Leadfree CopperSize:2 oz Soldermask:Green Material:FR-4 Min.HoleSize:0.2mm Min.Linewidth/Space:4mil SpecialTechnique:ImpedanceControl,Gold finger OurPCBfabricationcapacity: 1.LayerCount:1-22layersHDI 2.Material:CEM1,CEM3,FR-4,HighTGFR4,halogen-freeFR4,aluminium,ceramicetc. 3.MaximumSize:610mm×1200mm 4.Boardthickness:0.125mm-6.0mm 5.MinimumLine/Space:0.075mm 6.MinimumDrillingHole(Mechanical):0.15mm 7.MinimumLaserHole:0.075mm 8.CopperThickness:17µm-175µm 9.MiniSolderMaskBridge:0.025mm 10.ImpedanceControlTolerance:l.±5% 11.Surfacefinishing:HASL,LEAD-FREEHASL,Immersiongold,Immersiontin,ImmersionSilver,Platedgold,OSP,Carbonink. 12.SolderMaskColor:Green,Red,White,Yellow,Black,Blue. 13.QualityStandards:IPC-A-600FandMIL-STD-105DCHINAGB4588 14.InnerPacking:Vacuumpacking/PlasticbagOuterPacking:StandardCartonPacking 15.SpecialRequirements:Buriedandblindvias+controlledimpedance+BGA 16.ProvidesOEMservicestoallkindsofPCBAaswellaselectronicencasedproducts 17.Profiling:Punching,Routing,V-CUT,Beveling 18.Certificate:UL,ISO9001:2000,ISO14001,SGS,ROHS