*** Halbleiterlaser-Lötanlage

Semiconductor Laser Soldering Machine Features Automatic soldering table with four-axis motion; It can realize weld by turns to make full use of the system and inprove working efficiency; Three-dimension-adjustable wire-feeding position and axis-adjustable tin-feeding system Easy to control, good adaptability, compatible for the workpiece of small size and complex shape It can reach inaccessible location to achieve long-distance and non-contact welding with good flexibility. Applications Widely used for cables, circuit boards, IC, electronic components and so on. Semiconductor laser solder specification Item Laser Parameter Laser continuous power 0-120W Sytstem Dimension (mm) 700*1000*1900 Control system Microcomputer System Cooling Internal Air cooling Electricity requirements 220V/50HZ/18A System consumed power 1500W