陶瓷基底

Ceramics with metalizing, plating and brazing, which is one type of ceramics joining or the application of a thin coating of metal to ceramic materials. It has excellent properties of electrical insulation, low electrical loss, high purity, hermetic sealing.Substrate Material: Al2O3 95% Dielectric Strength: 8.3 KV/ mm Compressive Strength: 2100 MPa Max. Use Temperature: 1700 CJOINING TYPE Ceramic + Mo/Mn metallization + plating Ni + brazing Ag (Vacuum brazing and brazing under controlled atmospheres) APPLICATIONS It is used as high voltage vacuum switch, electrical networks, silicon-controlled rectifier parts, potentiometer circuit substrate, refrigerating unit circuit substrate, integrated circuit substrate, electric circuit substrate, which are widely adopted in the fields of electric power, electronics, metallurgy, machinery, astronautics, aviation, military etc. Features High pull out strength Excellent Electrical Insulation Thermal Conductive Properties Lower Thermal Expansion Coefficient High temperature resistance High voltage resistanceCustom manufacture available; ceramic substrate;